NETWORK
TechnologyGSM / HSPA / LTE
2G bandsGSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
3G bandsHSDPA 850 / 900 / 2100
4G bands1, 3, 5, 7, 8, 20, 28, 38, 40, 41
SpeedHSPA, LTE
LAUNCH
Announced2023, June 15
StatusAvailable. Released 2023, June 15
BODY
Dimensions168.6 x 76.3 x 8.2 mm (6.64 x 3.00 x 0.32 in)
Weight198.5 g (7.02 oz)
BuildGlass front, plastic frame, glass back
SIMHybrid Dual SIM (Nano-SIM, dual stand-by)
 IP53, dust and splash resistant
DISPLAY
TypeIPS LCD, 90Hz, 550 nits (peak)
Size6.79 inches, 109.5 cm2 (~85.1% screen-to-body ratio)
Resolution1080 x 2460 pixels (~396 ppi density)
PLATFORM
OSAndroid 13, MIUI 14
ChipsetMediatek Helio G88 (12nm)
CPUOcta-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
GPUMali-G52 MC2
MEMORY
Card slotmicroSDXC (uses shared SIM slot)
Internal128GB 4GB RAM, 128GB 8GB RAM, 256GB 8GB RAM
 eMMC 5.1
MAIN CAMERA
Triple50 MP, f/1.8, (wide), PDAF
8 MP, f/2.2, 120˚ (ultrawide)
2 MP, f/2.4, (macro)
FeaturesLED flash, HDR
Video1080p@30fps
SELFIE CAMERA
Single8 MP, f/2.1, (wide)
Video1080p@30fps
SOUND
LoudspeakerYes
3.5mm jackYes
COMMS
WLANWi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth5.3, A2DP, LE
PositioningGPS, GLONASS, BDS, GALILEO
NFCYes (market/region dependent)
Infrared portYes
RadioFM radio
USBUSB Type-C
FEATURES
SensorsFingerprint (side-mounted), accelerometer, compass
MessagingSMS(threaded view), MMS, Email, Push Email, IM
BrowserHTML5
BATTERY
TypeLi-Po 5000 mAh, non-removable
Charging18W wired, PD